High thermal conductivity pin fin heat sink addressing thermal challenges of high-density packaging.
This is a high-performance heat sink that adopts a cold-forged pin fin structure. The densely arranged pin fin structure maximizes the heat dissipation area, achieving high cooling performance even in limited spaces.
It is suitable for high-heat-generating devices such as 1U servers, communication equipment, industrial PCs (IPC), FPGAs, CPUs, and SoCs, contributing to solving thermal design challenges in high-density mounting environments.
- High heat dissipation performance due to cold-forged pin fin structure
- High heat exchange efficiency achieved even in a compact design
- Compatible with 1U and high-density mounting environments
- Suitable for a wide range of applications including CPUs, FPGAs, SoCs, and communication ICs
- Custom design available (size, material, shape)
The integrated pin fin structure formed by cold forging achieves higher fin density and uniform heat dissipation performance compared to conventional extruded heat sinks. It efficiently disperses airflow even within limited enclosure space, balancing reduced thermal resistance with stable thermal diffusion performance.
